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詳細情報 |
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| 伝導力: | 500 W | 流量: | 1～5リットル/分 |
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| 素材の質感: | 6061 | 適用可能な媒体: | 水 |
| 特徴: | 新技術と高出力冷却 | 製品名: | 液体冷却プレート |
| 表面処理: | オイルを除去、洗浄、不動態化 | 幅: | 顧客の需要に応じて |
| 本体材質: | アルミニウム | ||
| ハイライト: | copper medical friction welding cold plate,water cooling block FSW plate,liquid cooling plate with warranty |
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製品の説明
New design copper medical friction welding stir water cooling block FSW cold plate
The following is about New design copper medical friction welding stir water cooling block FSW cold plate related, I hope to help you better understand aluminum skived fin heat sink cnc machined skiving fin heat sink.Material: CopperProduct dimension:85x85x52 mmProduct weight: 0.12 kgFeature: New technology and high power coolingSurface treatment: anodized without coloringHeat conducting power: 400 WProduct Technology: CNC maching + surface finish
FSW Cold Plate
Friction Stir Welded Liquid Cold Plates
This friction stir welding liquid cold plate base material is AL6061, A longitudinal channel is formed on the base through a deep hole drill, and then it is milling through at both ends of the transverse interval, and the channel is closely connected by friction stir welding. In the direction of more compression strength and thinner thickness, FSW cold plate this technology has been successfully applied to the liquid cooled heat sink of high power fiber laser.
The surface treatment technology of hard anode is made possible by the material with similar composition and the friction stir welding process without adding solder.
FSW Cold Plate finished with hard anodized, so the fiber laser can withstand the test of harsh service environment and long-term fluid erosion.
New‑Design Copper Medical‑Grade Friction Stir Welding Water‑Cooling Block (FSW Cold Plate)
Product Introduction
This is a newly upgraded copper water‑cooling cold plate, integrally manufactured via precision Friction Stir Welding (FSW). Specially designed for high‑end heat dissipation scenarios such as medical equipment and precision instruments, it features efficient heat conduction, stable temperature equalization and long‑term operational reliability, meeting the cooling requirements of various rack‑mounted devices.
Core Technology
Adopting solid‑state friction stir welding technology, it produces no molten pool, no filler material and no cold solder joints. The internal channels deliver outstanding sealing performance, effectively avoiding leakage, gaps and high thermal resistance commonly found in traditional welding processes.
The main body is processed from high‑thermal‑conductivity copper with precisely milled fluid channels. High overall strength and structural stability after welding make it suitable for harsh operating environments.
Key Advantages
- Ultra‑high heat transfer efficiency: The copper base offers excellent thermal conductivity. Combined with seamless FSW welding, it provides smooth heat transfer paths to rapidly dissipate heat generated during device operation with accurate and stable temperature control.
- Safe, durable and low‑loss: Integral forming eliminates assembly gaps for reliable sealing. Vibration‑resistant and corrosion‑resistant, it resists leakage and aging during long‑term operation, satisfying continuous stable operation requirements of precision equipment.
- Medical‑grade clean craftsmanship: Full‑process precision machining and cleaning treatment result in smooth, burr‑free surfaces, ideal for scenarios with strict cleanliness and stability standards such as medical instruments and precision industrial control systems.
- Rack‑mount compatible structure: Regular shape and standardized mounting holes enable direct assembly with rack‑mounted devices, compatible with various modular cooling systems.
Application Scenarios
Medical imaging equipment, precision testing instruments, rack‑mounted industrial control devices, laboratory precision power supplies, high‑end energy storage control modules, high‑power precision electronic devices, etc.
Surface Treatment & Customization
Surface treatments including passivation and precision cleaning are available. Fluid channel layout, inlet/outlet specifications and mounting dimensions can be customized on demand to match heat dissipation solutions for different devices.
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