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詳細情報 |
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| 材料: | 銅 | サイズ: | 15*2.8*0.3センチメートル |
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| 重さ: | 0.09kg | テクノロジー: | スタンピングフィン |
| 特徴: | 柔軟で調整可能 | 表面処理: | 不動態化 |
| 熱冷却力: | 45W | ||
| ハイライト: | copper folded fin heat sink,liquid cooling plate with warranty,high thermal conductivity heat sink |
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製品の説明
Copper Folded Fin Heat Sink for Various Shapes
Product parameters of Customized Copper Folded Fin Heat sink for various shapes
Material: copper
Size:15*2.8*0.3CM
Weight: 0.09 kg
Technology: Stamping fin
Feature: Flexiable and ajustable
Surface treatment: Passivation
Heat cooling power: 45W
Product advantage of Customized Copper Folded Fin Heat sink for various shapes
High density fins heat sink Stacked fin heat sink combination heatsink design makes it possible to fabricate large sized densely packed fabfin structures for high power heat sink requirements, unlimited possibilities as to length, width, height, fin thickness and fin spacing, swaged process allows a multitude of aluminum fins are mechanically attached to dual aluminum baseplates at the same time without using any adhesive. The concept of increasing fin efficiency by sharing fins between two baseplates originated in the one piece hollow extrusion. The standard available line of shapes extends almost every .25" in height from 1.00" to 8.00" high at fin spacing of about 0.10",and high aspect ratios could reach 50:1
Therefore,High density stacked bonded extrusion heatsink will be smart choice.
Manufacturing Process & Materials
- Material Specifications: Typically pure copper (C11000/C10200, oxygen-free copper for ultra-high conductivity); fin thickness 0.1–0.4 mm, folded into corrugated/zig-zag arrays, then bonded to a copper base via brazing (vacuum/atmospheric), solder reflow, or high-performance thermal epoxy. Base thickness can be independently optimized (3–20 mm common).
- Fin & Shape Customization: Fins can be flat-crest, rounded-crest, wavy, lanced-offset, or herringbone; bases can be CNC-machined into complex geometries (holes, cutouts, curves, steps) post-bonding.
- Surface Treatments: Nickel plating (corrosion resistance, solderability), black oxide, passivation; avoid anodizing (copper anodization is unstable vs aluminum).
Core Advantages vs Aluminum Folded Fin
- Higher Thermal Conductivity & Heat Spreading: Faster heat transfer from source to fin tips, critical for high-heat-flux (≥100 W/cm²) scenarios.
- Better Performance at Low Airflow: More effective passive cooling, though forced air still drastically improves efficiency.
- Durability & Corrosion Resistance (with plating): Suitable for harsh environments (automotive underhood, industrial controls).
- Drawback: ~3x heavier than aluminum, higher material and processing costs.
Design & Optimization Tips
- Thermal Load & Airflow: Calculate required thermal resistance (Rθja, Rθjc) and match to CFM/LFM; dense folded fins need ≥100 CFM forced air to avoid airflow stagnation.
- Fin Pitch & Height: For forced air, 1.0–2.0 mm pitch balances surface area and pressure drop; taller fins (up to 60 mm) improve convection but add weight.
- Bonding Quality: Vacuum brazing > solder > epoxy for thermal contact; poor bonds create hotspots—verify with thermal imaging or Rθ measurement.
- Weight Budget: Copper’s density (8.96 g/cm³) requires careful mass control in aerospace/portable devices; consider copper-fin+aluminum-base hybrid designs.
Applications
Sourcing & Cost Considerations
- MOQ is often 100–500 units for custom shapes; tooling costs rise with complexity (curved/annular > rectangular).
- Lead time: 4–8 weeks for design, prototyping, and production runs.
- Cost drivers: material price, fin density, bonding method, plating, and custom machining steps.
